featured products
- XP - An upgrade option that extends the performance of 281X/282X broadband brightfield inspectors by integrating design-aware inspection capability and recipe acceleration features.
- AcuShape™ – A new modeling and library-generation package enabling KLA-Tencor's optical critical dimension metrology systems to meet requirements for the 32nm node and below.
- EtchTemp SensorWafer™ – A next generation wafer temperature measurement system with unique capabilities to characterize high-power, high-frequency etch recipes proliferating at 65nm nodes and below.
- TeraScan®XR – An extension of our industry-leading TeraScan reticle inspection platform, bringing high-resolution reticle-, aerial- and wafer-plane inspection capability to the 32nm node.
- PVI-6™ – A family of modules designed for the inspection of photovoltaic wafers and cells at the highest speed and accuracy for all stages of the production process
Announcements
- KLA-Tencor Announces Analyst Briefing At SEMICON West 2009 (07/01/2009)
- New XP Upgrade For KLA-Tencor’s 28xx Defect Inspection Systems Provides Enhanced Sensitivity, Productivity, Defect Yield-Relevance (06/30/2009)
- KLA-Tencor Announces Live Webcast Of Upcoming Bank Of America And Merrill Lynch U.S. Technology Conference Investor Presentation (05/21/2009)
We Partner with Our Customers
to develop solutions tailored to their objectivesResults:
- A faster path from data to decisions
- Quicker response to changes in the market
- Reliable, high performance products
- Higher profitability and ROI
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