featured products

• TeraFabHT – Reticle defect inspection system providing next-generation haze sensitivity for leading-edge single-die and multi-die masks, to warn a fab of reticle defects before they print on the wafer.
• eDR-5210S – High resolution e-beam wafer defect review system with new Reticle Defect Review and Critical Point Inspection capabilities, for accelerated identification of systematic defects from reticles, design hot spots and other sources.
• Archer 300 LCM – Overlay metrology system with the precision, measurement speed and cost-of-ownership required to support scanner qualification and high volume production monitoring of 2Xnm and below IC process technologies.
• PROLITH X3.1 – A virtual lithography tool that models line edge roughness and replicates underlying wafer topography, enabling researchers to cost-effectively investigate EUV and double patterning lithography technologies.

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• A faster path from data to decisions
• Quicker response to changes in the market
• Reliable, high performance products
• Higher profitability and ROI