The LDS3300M and LDS3300C macro defect inspection and review systems enable automated capture, review and classification of a broad range of macro defect types at very high throughput. Delivering quick dispositioning decisions (Go, NoGo, Inline Review, Alarm), the system enables fab engineers to take corrective action early, when wafers can be reworked, or process tool problems can be repaired before additional lots are risked. Ideally suited for the lithography module, the LDS3300 systems can be integrated rapidly and seamlessly into a production environment.
 

• Simultaneous full-color brightfield and multi-angle darkfield optics enable capture of a broad range of macro litho defects
• Up to 130 wph (300mm) throughput to enable statistically valid lot sampling and quick disposition
• Automated inspection of partial die, edge exclusion zone, and scribe areas
• Easy setup including waferless recipe creation to reduce time to production
• Field-upgradeable from INS3300 to protect capital investment
• Consistent results from tool to tool, day to day, and fab to fab
• Full factory automation to minimize costly human intervention
• Field-proven ROI vs. manual inspection
• Optional backside inspection for defects which may cause focus errors on the frontside
• Optional edge inspection and edge review especially for iLitho related defects

• Brightfield, darkfield and differential interference contrast (DIC) optical modes for re-detection and accurate classification of the widest range of defects
• UV and DUV optics with full autofocus capability for highest resolution (>80nm) imaging of defects and surrounding structures
• Simultaneous inspection and review using a second wafer stage, for fastest time to results
• User-friendly high performance automatic defect classification (ADC-HP) option, using information from the defect image and stored knowledge to classify defects consistently and accurately
• Specialized automated inspection with SpotCheck

Lithography Applications

Macro Inspection: Hot spots, comets, particles, scratches, defocus, insufficient, nonuniform resist, resist drips, resist residues or bubbles, color variation caused by nonuniform film thickness, edge-bead removal (EBR) width and offset, embedded and surface defects

SpotCheck: Overlay measurement, bond pad and fuse inspection, reticle ID check

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